Die-cut polyimide film: Enables precise masking of specific circuit board areas for targeted protection
Pressure sensitive silicone adhesive: Ensures secure attachment to board surfaces for reliable coverage
Clear split back liner: Allows for easy removal after soldering without residue
Optimal electrical and thermal insulation: Maintains circuit board integrity during wave soldering
ESD-safe design: Reduces risk of electrostatic discharge during sensitive manufacturing processes
Summarized by Shop
Polyimide Masking Discs
Die cut polyimide film with pressure sensitive silicone adhesive on a clear split back liner is designed to protect areas on circuit boards during wave soldering and provides optimal performance in electrical and thermal insulation.
Data Sheet
